PILL Horizontal Immersion Tin
In recognising the current and future lead-free requirements, Stevenage Circuits installed the PILL Horizontal Immersion Tin process in 2002. The conveyorised system provides a superbly flat and even finish across the entire panel.
To see the equipment specification please take a look at the PDF below, however please note that the Ormecom chemistry is not currently used:
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There are several benefits to an immersion tin finish on PCBs:
- 100% lead-free
- Ability to solder directly on to copper
- Low operating temperatures in processing therefore no thermal stress prior to assembly
- 1 year shelf life in dry storage
The process chemistry is obviously the most important part of any chemical processing line, and Stevenage Circuits has chosen the renowned Stannatech chemistry from Atotech. Further information can be found here:
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In the past, potential issues in PCB production have been raised with immersion tin processing, especially with regard to 'Tin Whiskers'. One of the many reasons behind Stevenage Circuits' choice of chemistry from Atotech is the fact that the Stannatech solution provides active suppression of the 'Tin Whisker' phenomenon. Please read the following technical datasheet if you require more detailed information:
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