We would like to use cookies to ensure we give you the best experience on our website. If you consent to us using cookies, please click 'Accept Cookies'.

Design Rules

Advanced is reduced yield, Technical is for development.

Trace & Space Standard Advanced Technical
Minimum Width P&E Base Cu Foil Thickness: 12µm 60µm 50µm < 50µm
Minimum Width Plated 89µm 76µm 60µm
Minimum Space P&E 76µm 60µm 50µm
Minimum Space Plated 102µm 89µm 76µm
Minimum Width P&E Base Cu Foil Thickness: 17µm 76µm 60µm 50µm
Minimum Width Plated 102µm 89µm 76µm
Minimum Space P&E 89µm 76µm 50µm
Minimum Space Plated 102µm 89µm 76µm
Minimum Width P&E Base Cu Foil Thickness: 35µm 102µm 89µm 76µm
Minimum Width Plated 127µm 102µm 89µm
Minimum Space P&E 112µm 102µm 89µm
Minimum Space Plated 127µm 112µm 102µm
Minimum Width P&E Base Cu Foil Thickness: 70µm 127µm 112µm 102µm
Minimum Width Plated 152µm 127µm 112µm
Minimum Space P&E 152µm 127µm 112µm
Minimum Width Plated 229µm 204µm 178µm

 

Annular Ring & Clearaces Standard Advanced Technical
Pad Annulus to meet the requirements of IPC Class 2* 127µm 102µm 89µm
Pad Annulus to meet the requirements of IPC Class 3* 178µm 152µm 127µm
Micro Via Annulus: Entry pad (Top pad) 112µm 89µm 64µm
  Target Pad (Stop pad) 64µm 52µm 39µm
Drill to Copper Feature - Annular clearance 178µm 152µm 127µm
Pad to Anti-Pad Clearance: Etched layers 127µm 102µm 76µm
  Plated Layers 152µm 127µm 102µm
Copper to board edge Mechcanical 102µm 76µm 51µm
  Laser 76µm 51µm <51µm
* The table above refers to designs based on a single lamination, for designs requiring multiple laminations add an additional 20µm for each additional lamination.

 

Feature Clearances Standard Advanced Technical
Solder-Mask Annulus 76µm 51µm 25µm
Solder-Mask Dams ENIG / ENIPIG 89µm 76µm -
  Immersion Tin 89µm 76µm -
  Immersion Silver 76µm 62µm -
Ident Clearance (clip) to Solder-mask clearance 50µm 50µm 50µm
Ident Minimum Line Minimum Width 127µm 102µm 102µm