Design Rules

Advanced is reduced yield, Technical is for development.

Trace & Space Standard Advanced Technical
Minimum Width P&E Base Cu Foil Thickness: 12µm 60µm 50µm < 50µm
Minimum Width Plated 89µm 76µm 60µm
Minimum Space P&E 76µm 60µm 50µm
Minimum Space Plated 102µm 89µm 76µm
Minimum Width P&E Base Cu Foil Thickness: 17µm 76µm 60µm 50µm
Minimum Width Plated 102µm 89µm 76µm
Minimum Space P&E 89µm 76µm 50µm
Minimum Space Plated 102µm 89µm 76µm
Minimum Width P&E Base Cu Foil Thickness: 35µm 102µm 89µm 76µm
Minimum Width Plated 127µm 102µm 89µm
Minimum Space P&E 112µm 102µm 89µm
Minimum Space Plated 127µm 112µm 102µm
Minimum Width P&E Base Cu Foil Thickness: 70µm 127µm 112µm 102µm
Minimum Width Plated 152µm 127µm 112µm
Minimum Space P&E 152µm 127µm 112µm
Minimum Width Plated 229µm 204µm 178µm

 

Annular Ring & Clearaces Standard Advanced Technical
Pad Annulus to meet the requirements of IPC Class 2* 127µm 102µm 89µm
Pad Annulus to meet the requirements of IPC Class 3* 178µm 152µm 127µm
Micro Via Annulus: Entry pad (Top pad) 112µm 89µm 64µm
  Target Pad (Stop pad) 64µm 52µm 39µm
Drill to Copper Feature - Annular clearance 178µm 152µm 127µm
Pad to Anti-Pad Clearance: Etched layers 127µm 102µm 76µm
  Plated Layers 152µm 127µm 102µm
Copper to board edge Mechcanical 102µm 76µm 51µm
  Laser 76µm 51µm <51µm
* The table above refers to designs based on a single lamination, for designs requiring multiple laminations add an additional 20µm for each additional lamination.

 

Feature Clearances Standard Advanced Technical
Solder-Mask Annulus 76µm 51µm 25µm
Solder-Mask Dams ENIG / ENIPIG 89µm 76µm -
  Immersion Tin 89µm 76µm -
  Immersion Silver 76µm 62µm -
Ident Clearance (clip) to Solder-mask clearance 50µm 50µm 50µm
Ident Minimum Line Minimum Width 127µm 102µm 102µm