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Tolerance

Advanced is reduced yield, Technical is for development.

Mechanical Constraints Standard Advanced Technical
Maximum Board Thickness 4.45mm 6.35mm 10.20mm
Thickness Tolerance +/-10% +/-7% +/-5%
Min Thru Hole Size: Mechanical 0.25mm 0.20mm 0.15mm
  Laser 125µm 90µm 60 µm
Maximum Aspect Ratio Thru Holes * 8:1 12:1 16:1
Maximum Aspect Ratio Blind Holes* 0.8:1 1:1 1.3:1
Maximum Board Size: ** mm 572 x 419 572 x 572 > 572 x 572
  mm 560 x 407 561 x 407 635 x 483
  mm 560 x 407 561 x 407 636 x 483

 

Special Constraints Flex-rigid Standard Advanced Technical
Minimum distance from a PTH hole to the flex/rigid Interface 1.00mm 0.75mm 0.50mm
Minimum distance from Cu Feature to the flex/rigid Interface 0.75mm 0.50mm <0.50mm

 

Production Tolerances Standard Advanced Technical
Mechanical Holes: Diametric +/-0.100mm +/-0.050mm +/-0.050mm
Postional Hole to PCB Edge +/-0.100mm +/-0.065mm +/-0.050mm
  Hole to Hole +/-0.065mm +/-0.050mm +/-0.050mm
  Hole to Image +/-0.10mm +/-0.065mm +/-0.050mm
Laser Drilled Holes: Diametric +/-0.050mm +/-0.025mm +/-0.025mm
Postional Hole to PCB Edge +/-0.100mm +/-0.050mm +/-0.050mm
  Hole to Hole +/-0.025mm +/-0.025mm +/-0.025mm
  Hole to Image +/-0.100mm +/-0.065mm +/-0.050mm
Mechanical Profiling Linear +/-0.100mm +/-0.065mm +/-0.050mm
  Positional +/-0.100mm +/-0.065mm +/-0.050mm
  Profile to Image +/-0.100mm +/-0.065mm +/-0.050mm
Laser Profiling: Linear +/-0.100mm +/-0.050mm +/-0.050mm
  Positional +/-0.100mm +/-0.065mm +/-0.050mm
  Profile to Image +/-0.100mm +/-0.065mm +/-0.050mm
Please Note - the actual achievable tolerance will be detirmined by the combination of the the materials, construction, process technology and product design.

* Calculated on finished hole diameter

** Test Coupons (IPC, Controlled Impedance etc.) significantly reduce the maximum circuit size.