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Stevenage Circuits & Coventry University, form Innovation Partnership

Story posted 27/10/2014

A programme devised by the UK's Technology Strategy Board, known as the Knowledge Transfer Partnership (KTP), has enabled a collaboration between Coventry University (Knowledge base) and Stevenage Circuits Limited (Industry). The partnership will allow flow of information from the University to the company where it can be directed toward innovative projects. Coventry University brings in the expertise of Dr. Andrew Cobley and his Functional Materials team, represented by Narinder Bains, whilst the project at Stevenage Circuits is led by Tim Gee, technical director and Phil Firth, technical manager.

The aim of the project is to improve the manufacturing capability to meet the future requirements of the electronics industry particularly for high reliability military-aerospace grade HDI (high-density-interconnect) PCBs. As technology advances, in particular the component packaging device technology, the need for miniaturisation in the field of high density interconnect (HDI) PCBs is increasing. As the inexorably increase in packaging densities continues the device footprints reduce to a point where current PCB fabrication technology will no longer be capable of meeting the requirement.

To view the entire published article: http://www.pcb007.com/pages/zone.cgi?a=104384

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